General Info
Plavis® HM Polyimide is an additive-free, compression-molded high-performance polyimide developed for demanding semiconductor test socket, wafer processing, wafer handling, electrical/electronic, and high-temperature industrial applications. It provides excellent heat resistance, dimensional stability, mechanical strength, machinability, electrical insulation, and wear resistance.
With a flexural modulus of approximately 1,001,000 psi, 29,000 psi flexural strength, 0.03% water absorption, and a low CLTE of approximately 1.67 x 10^-5 in./in./°F, Plavis® HM offers high resistance to deformation and dimensional change. Its combination of stiffness and ductility helps minimize burring and cracking during precision machining, making it particularly well suited for fine-pitch test sockets requiring high contact density and accurate hole positioning.
Plavis® HM also demonstrates excellent dimensional stability under high-temperature and moisture exposure, with lower hole-position change than other polyimide materials evaluated in the test-socket study. Its combination of high modulus, low moisture absorption, heat resistance, wear resistance, and precision machinability makes it an excellent material for advanced semiconductor test socket applications. Download our
PLAVIS HM Technical Test Socket Material Comparison and see how Plavis® HM compares to PEEK and other common test socket materials.
Click for more information on the complete line of Plavis Polyimides
NOTE: Plavis may be compared favorably to Vespel ® polyimide produced by DuPont.
Test Socket Advantages for Plavis-HM
| Property
| Plavis-HM Advantages |
|---|
| Flexural Modulus
| Approximately 1,001,000 psi, providing high stiffness and resistance to deformation. Plavis-HM has a higher flexural modulus than Plavis-S, Plavis-N, PEI, PEEK, PAI, and the glass-fiber-filled composite shown in the test socket comparison.
|
| Water Absorption
| Very low 0.03% water absorption, helping reduce moisture-related dimensional change. Plavis-HM has lower water absorption than Plavis-S, Plavis-N, PAI, glass-fiber-filled composite, PEI, and PEEK in the test socket comparison.
|
| Dimensional Stability
| Lower hole-position change under heat and moisture exposure than the other Plavis grades shown, helping maintain precision and dimensional accuracy.
|
| Machinability
| Its combination of stiffness and ductility helps minimize burring and cracking during precision machining.
|
| Fine-Pitch Capability
| Well suited for smaller-pitch test socket designs requiring accurate, closely spaced machined holes and high contact density.
|
| Heat & Wear Resistance
| Excellent heat and wear resistance for demanding semiconductor test socket applications.
|
Key Properties
- High Flexural Modulus
- Excellent Dimensional Stability
- Very Low Water Absorption
- Excellent Heat Resistance
- Tensile Strength 7,980 psi at 500 F
- Low CLTE 1.67 x 10^-5 in./in./F
- Thermal Conductivity 2.43 BTU-in/hr-ft2-F
- Excellent Machinability
- Electrical Insulation
- Excellent Wear Resistance
Limitations
- Chemical Resistance to Some Strong Acids and Bases
- Hydrolyzes in Presence of Steam
- PLAVIS should not be used in strong alkali conditions such as a PH over 10
- The chemical structure of PLAVIS is not resistant to bases
Applications
- Semiconductor Test Sockets
- Test Socket Housings
- Wafer Processing Components
- Wafer Handling Components
- Electrical and Electronic Components
- High Temperature Industrial Components
- High Load Industrial Components
Resin Trade Names
Manufacturer Trade Names
Boedeker Plastics, Inc. stocks & supplies plastic sheet, rod, tube, film and custom profiles and machine parts from these shapes that are produced from plastic resin. In many cases the manufacturer of the shape has their own product trade name. If your specification calls for a specific resin grade or manufacturer trade name, we can supply a shape made from that resin to meet your specification or suggest an equal. If you require a specific resin or brand it must be specified at the time of order.
Available Sizes
Size Availability
PLATE
Length x Width: 12 inches x 12 inches (304.8 mm x 304.8 mm)
Thickness: 2 inches (50.8 mm)
ROD
Diameter: 1/4 inches (6.35 mm) | 3/8 inches (9.53 mm) | 7/16 inches (11.11 mm) | 1/2 inches (12.70 mm) | 5/8 inches (15.88 mm) | 3/4 inches (19.05 mm) | 1 inches (25.40 mm) | 1-1/4 inches (31.75 mm) | 1-1/2 inches (38.10 mm) | 2 inches (50.80 mm)
Length: 19.6 inches (500 mm)
Note: Minimum Order Quantities and longer lead times may apply.